Advanced Packaging Metrology
Integrated circuit (IC) chip packaging technology has been advancing at a fast pace, with smart mobile devices driving down the form factor, and cloud computing driving up performance requirements, such as processing speed. Similarly, the semiconductor industry also is seeking ways to increase yield and lower costs. Traditional 2D metrology is no longer adequate for process development or process control for many of wafer level packaging (WLP) schemes, such as fan-out wafer level packaging (FO-WLP), fan-in wafer level chip scale packaging (WLCSP), flip-chip, and other 2.5D or 3D packaging technologies.
DIDAC white light interferometry-based Contour 3D optical metrology systems produce the critical 3D geometric measurements needed for advanced IC packaging applications, and provide: