DIDAC INTERNATIONAL
Fully Automatic Grinders

Fully Automatic Grinders

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Fully Automatic Grinders

Grinders can thin silicon wafers, compound semiconductors, and many other types of materials with a high degree of accuracy. Processing for applications which use the DBG system or DAF (Die attach film) is also possible by incorporating a polisher and wafer mounter with the grinder into an inline system

Specification:

 

  1. Max. Workpiece size mm: ΓΈ300
  2. Processing method: Fully automatic
  3. Max. feed speed mm/s: 1.0 - 1,000, 0.1 - 600
  4. Positioning accuracy mm: Within 0.003/310
  5. Dimensions (WxDxH) mm: 1,560 x 1,550 x 1,800 , 1,200 x 1,550 x 1,800
  6. Weight kg: Approx. 2,300, Approx. 1,750