DIDAC INTERNATIONAL
Tribometers and Mechanical Testers

Tribometers and Mechanical Testers

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Tribometers and Mechanical Testers
  • The new DIDAC CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost effective characterization of wafer polishing processes.
  • Reproduces full-scale wafer polishing-process conditions
  • Provides unmatched measurement repeatability and detail
  • Performs tests on small coupons rather than whole wafers for substantial cost savings
Technical Detail:
  • Delivers more visibility into transient polishing properties than any other system on the market
  • Collects data from the instant the substrate touches the pad and throughout the entire test
  • Enables early-stage process development decisions through more complete, detailed data
  • Polishes any flat material, using virtually any conditioning disc, any slurry, and any pad
  • Accommodates small coupons and up to whole 100mm wafers with ease
  • Accepts multiple sample mounts for flexibility