The JVSensus is the latest defect metrology system
for Si device manufacturers. It helps identify problems encountered during
wafer production using the latest X-ray diffraction imaging (XRDI) technology.
Applications include monitoring edge damage to prevent costly wafer breakage
during ultra fast anneal. It can qualify and monitor process tools at any
technology node, which reduces cycle times and facilitates fab expansion.
Identify Crystalline Defects
- JVSensus enables its users to identify cracks and
other defects in the wafer which can cause catastrophic structural failure,
BEFORE the breakage occurs. Once a defect has been observed, non-destructive
cross section review images can be performed to locate the defect locations
within the wafer depth.
2. Measure on
- Measurements can be performed on blanket,
patterned, and metalized wafers without sample preparation. The defects can be
identified even when a pattern is present on the wafer. Robot loading can be
added for wafers sizes from 2” to full 300mm
3. Detect Slip
- The major cause of overlay issues is slip. Whether
it's a logic patterned wafer, GaN on Si or ingot slides , JVSensus can detect
slip in minutes.